Published

Engineering Sciences

Experimental And Numerical Characterization Of PCB-Embedded Power Dies Using Solderless Pressed Metal Foam

Published on - 2020 22nd European Conference on Power Electronics and Applications (EPE'20 ECCE Europe)

Authors: Said Bensebaa, Mounira Bouarroudj-Berkani, Stéphane Lefebvre, Mickael Petit, N. Schmitt

See the publication on HAL DOI