Experimental And Numerical Characterization Of PCB-Embedded Power Dies Using Solderless Pressed Metal Foam

Publié le 7 septembre 2020 - 2020 22nd European Conference on Power Electronics and Applications (EPE'20 ECCE Europe)

Auteurs : Said Bensebaa, Mounira Bouarroudj-Berkani, Stéphane Lefebvre, Mickael Petit, N. Schmitt