Published

Electric power

3D PCB package for GaN inverter leg with low EMC feature

Published on - 2020 22nd European Conference on Power Electronics and Applications (EPE'20 ECCE Europe)

Authors: Pawel Derkacz, Jean-Luc Schanen, Pierre-Olivier Jeannin, Piotr Musznicki, Piotr Chrzan, Mickael Petit

See the publication on HAL DOI