Published

Engineering Sciences

A combined physicochemical-microstructural approach to predict the crack path at the topside interconnections in IGBT power devices

Published on - Microelectronics Reliability

Authors: Mustafa Shqair, Zoubir Khatir, Ali Ibrahim, Mounira Bouarroudj-Berkani, Ayda Halouani, T. Hamieh

See the publication on HAL DOI