A combined physicochemical-microstructural approach to predict the crack path at the topside interconnections in IGBT power devices

Publié le 30 avril 2022 - Microelectronics Reliability

Auteurs : Mustafa Shqair, Zoubir Khatir, Ali Ibrahim, Mounira Bouarroudj-Berkani, Ayda Halouani, T. Hamieh