Published

Electric power

Estimating Current Distributions in Power Semiconductor Dies Under Aging Conditions: Bond Wire Liftoff and Aluminum Reconstruction

Published on - IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Authors: Tien Anh Nguyen, Pierre-Yves Joubert, Stéphane Lefebvre, Denis Labrousse, Serge Bontemps

See the publication on HAL DOI