Estimating Current Distributions in Power Semiconductor Dies Under Aging Conditions: Bond Wire Liftoff and Aluminum Reconstruction

Publié le 31 mars 2015 - IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Auteurs : Tien Anh Nguyen, Pierre-Yves Joubert, Stéphane Lefebvre, Denis Labrousse, Serge Bontemps