Engineering Sciences
Experimental And Numerical Characterization Of PCB-Embedded Power Dies Using Solderless Pressed Metal Foam
2020 22nd European Conference on Power Electronics and Applications (EPE'20 ECCE Europe) -
Affichage des publications 891 à 900 sur 3711 au total
Engineering Sciences
2020 22nd European Conference on Power Electronics and Applications (EPE'20 ECCE Europe) -
Chemical Sciences
Sensors -
Electric power
IEEE Transactions on Industry Applications -
Engineering Sciences
Felix Nyffenegger -
Fluids mechanics
2020 IEEE Global Engineering Education Conference (EDUCON) -
Multiagent Systems
Journal of Computing and Information Technology -
Image Processing
Journal of Mathematical Imaging and Vision -
Acoustics
Biophotonics Congress: Biomedical Optics -