Engineering Sciences
Microstructural evolution during the crack propagation at the bond-wire contact area of IGBT power modules upon power cycling
Microelectronics Reliability -
Affichage des publications 591 à 600 sur 3859 au total
Engineering Sciences
Microelectronics Reliability -
Engineering Sciences
Microelectronics Reliability -
Engineering Sciences
Journal of Electronic Materials -
Automatic
4th IEEE International Conference on Electrical Sciences and Technologies in Maghreb - CISTEM 2022 -
Humanities and Social Sciences
2022 International Symposium on Electromagnetic Compatibility – EMC Europe -
Engineering Sciences
La Revue 3E.I -
Engineering Sciences
International Conference on Materials Science and Manufacturing Technology (ICMSMT 2022) -
Acoustics
International Congress on Acoustics -
Signal and Image processing
Signal Processing -