Materials

Temperature Levels Effects on the Thermo-Mechanical Behaviour of Solder Attach During Thermal Cycling of Power Electronic Modules

Publié le 15 juin 2008 - Power Electronics Specialists Conference, 2008. PESC 2008. IEEE

Auteurs : Mounira Bouarroudj-Berkani, Zoubir Khatir, Stéphane Lefebvre