Electronics

Reference Life Cycle Assessment of Smart Insoles with Piezoresistive Sensors for Motion Analysis

Publié le - CF '25 Companion: 22nd ACM International Conference on Computing Frontiers

Auteurs : Rachel Neveu, Jean Schoch, Gurvan Jodin, Sara Bretin, Florence Razan

The environmental impact of wearable electronics is a growing concern. This study applies a Life Cycle Assessment (LCA) to smart insoles with piezoresistive sensors, comparing an experimental prototype (XP) to a commercial model (CO). Using a cradle-to-grave approach aligned with ISO 14040 and 14044, the analysis quantifies impacts across material extraction, manufacturing, transport, use, and end-of-life. The results indicate that XP insoles have a significantly greater environmental impact than the optimized CO models. Materials, particularly PDMS and electronic components, along with manufacturing energy, are the primary contributors to this outcome. Normalization and weighting identify key environmental hotspots, emphasizing the role of eco-design in enhancing sustainability.