Power Cycling Test of PCB-Embedded Power Packaging

Power cycling test is the major reliability test method of conventional power modules due to temperature stress. In recent years new packaging technologies based on embedding active dies on the Printed Circuit Boards (PCB) are proposed. However, the reliability of these new technologies must be assessed. In this paper, experimental investigations on the already proposed solderless packaging in which connections are made using a pressed metal foam are presented. To assess the later packaging reliability, the devices have been subjected to power cycling conditions. Failure analysis have been made revealing degradations in the PCB interfaces.