Non-contact monitoring of current distribution in a PCB using 3D magnetic sensor

Publié le 11 juillet 2022 - 2022 IEEE Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)

Auteurs : Do Phuong Uyen Tran, Tienh Anh Nguyen, Herve Mathias, Emile Martincic, Stéphane Lefebvre, Pierre-Yves Joubert