Modular Multi-level Converter Hardware-in-the-Loop Simulation on low-cost System-on-Chip devices

Publié le 21 octobre 2018 - IECON 2018 - 44th Annual Conference of the IEEE Industrial Electronics Society

Auteurs : Daniel Tormo, R. Vidal-Albalate, Lahoucine Idkhajine, Eric Monmasson, R. Blasco-Gimenez