Engineering Sciences

Design And Characterization Of PCB-Embedded Power Dies Using Solderless Pressed Metal Foam

Publié le 7 juillet 2020 - PCIM Europe digital days 2020; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management

Auteurs : Said Bensebaa, Mounira Bouarroudj-Berkani, Stéphane Lefebvre, Mickael Petit