Microelectronics

Compressively-Stressed Test Structures for Opaque Micro-Structures Releasing Visualization

Publié le - International Conference on Microelectronic Test Structures

Auteurs : Agnes Tixier, E. Lebrasseur, T. Takahashi, Olivier Français, Bruno Le Pioufle, Yoshio Mita, H. Fujita, H. Toshiyoshi