Comparison of stress distributions and failure modes during thermal cycling and power cycling on high power IGBT modules

The paper presents experimental investigations on both power and thermal cycling conditions on 600V-200A six-pack IGBT power modules. Both types of cycles are compared in term of thermomechanical stresses by using Finite Element simulations. Finally, combined stresses are simulated in order to assess the real conditions of use of these devices in automotive applications. IGBT, High temperature electronics, Hybrid Power Integration, Power electronic modules, Packaging, Power cycling, Thermal cycling, Automotive Application.