Electronics

Ageing Test Results of low voltage MOSFET Modules for Electrical Vehicles

Publié le - EPE 2007 - 12th European Conference on Power Electronics and Applications

Auteurs : Laurent Dupont, Stéphane Lefebvre, Mounira Bouarroudj, Zoubir Khatir, Jean-Claude Faugieres, Francis Emorine

HEV is one of the harshest applications for standard technology of power devices and converters. High temperature capability and passive / active thermal cycle ageing must be evaluated. Authors present first results on ageing and failure modes for a 75V/350A MOSFET module from a low voltage / cycled DC current test bench. Bond wires are used for electrical connections between dies and between dies and DCB substrates. For this kind of low voltage and high current module, the main lifetime limitation at high temperature is related to the electric connexions. Automotive Application, High temperature electronics, Hybrid Power Integration, MOSFET, Packaging, Power cycling, Power Semiconductor device, Reliability, test Bench, Thermal Stress.