Engineering Sciences
Solder void position and size effects on electro thermal behaviour of MOSFET transistors in forward bias conditions
Microelectronics Reliability -
Affichage des publications 2371 à 2380 sur 4017 au total
Engineering Sciences
Microelectronics Reliability -
Signal and Image processing
2014 IEEE Conference on Antenna Measurements & Applications (CAMA) -
Chemical and Process Engineering
11th International Conference on Modeling and Simulation of Electric Machines, Converters and Systems (ELECTRIMACS’2014) -
Electric power
International Journal of Applied Electromagnetics and Mechanics -
Vibrations
Journal of Mechanical Science and Technology -
Engineering Sciences
IEEE Sensor Array and Multichannel Signal Processing Workshop - Invited article -
Signal and Image processing
2014 IEEE International Symposium on Medical Measurements and Applications (MeMeA) -
Engineering Sciences
2014 IEEE 23rd International Symposium on Industrial Electronics (ISIE) -
Electric power
IEEE Transactions on Power Electronics -