Electronics
Using Laminated Metal Foam as the Top-Side Contact of a PCB-Embedded Power Die
IEEE Electron Device Letters -
Affichage des publications 1731 à 1740 sur 4084 au total
Electronics
IEEE Electron Device Letters -
Engineering Sciences
Mathematics and Computers in Simulation -
Hardware Architecture
Journal of Low Power Electronics -
Materials Science
IEEE Transactions on Magnetics -
Physics
1st International web conference on forecasting -
Mechanics
22th International Workshop on Electromagnetic Nondestructive Evaluation (ENDE 2017) -
Signal and Image processing
ICASSP 2017 -